• Out-of-Stock

Sn42/Bi57/Ag1 Lead-Free, No-Clean solder paste

SLDP-AG1
Rating 
Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser.
This solder paste contains 1% of silver which makes solder joints much stronger.
€19.89
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Out-of-Stock

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Description
Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser.

This solder paste contains 1% of silver which makes solder joints much stronger.

Quantity: 30gr (in Nordson type 10CC EFD syringe)
Chemical composition: Sn42/Bi57/Ag1
Metal Particle Size: 25-45 Microns (Type 3)
Melting Point: 137C (278F)
Flux type: NO-Clean
Viscosity: 110 Pa·s (+-5)

The low viscosity (~110 Pa·s) of that solder paste is perfect for flawless application of even with the small diameter needles, on small footprints such as: 0603, 0402, QFN...

The No-Clean flux residue is non-corrosive, non-conductive and can remain on your PCB. Alternatively, it can be removed with a suitable solvent such as isopropyl alcohol or acetone.

In addition, what is important, thanks to the low melting temperature, it allows you to protect sensitive components such as: plastic connectors, buttons, LEDs, against overheating.

Product Details
SLDP-AG1
381010
381010
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Sn42/Bi57/Ag1 Lead-Free, No-Clean solder paste

Sn42/Bi57/Ag1 Lead-Free, No-Clean solder paste

Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser.
This solder paste contains 1% of silver which makes solder joints much stronger.
Write your review