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Sn42/Bi57/Ag1 No Clean Solder paste
SNBIA-SDRP
New product
Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser "out of the box".
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High quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC Nordson type EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser "out of the box".
Quantity: 30gr (in Nordson type 10CC EFD syringe)
Chemical composition: Sn42/Bi57/Ag1
Metal Particle Size: 25-45 Microns (Type 3)
Melting Point: 137C (278F)
Flux type: NO-Clean
Viscosity: 110 Pa·s (+-5)
The low viscosity (~110 Pa·s) of that solder paste is perfect for flawless application of even with the small diameter needles, on small footprints such as: 0603, 0402, QFN...
This particular solder paste contains 1% of silver which makes solder joints much stronger.
Also, what's important, with this low melting lead free solder paste you protect sensitive components such as: plastic connectors, buttons, LEDs from overheating.