Sn42/Bi57/Ag1 Lead-Free, No-Clean solder paste

SLDP-AG1

Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser.
This solder paste contains 1% of silver which makes solder joints much stronger.

€19.89
Tax excluded
Quantity

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Description

⚠️ATTENTION⚠️

Unfortunately, solder pastes became classified as “dangerous” (prohibited) goods by most shipping carriers. They are now heavily restricted and can only be shipped as “special shipments,” which come with prohibitively high costs.

Because we are required to sign a declaration confirming that our parcels do not contain any dangerous goods, we are, unfortunately, no longer able to ship solder pastes.

You can easily transfer solder paste from most commercially available syringes into the I-Extruder empty syringes by using a “luer-to-luer” adapter like this one:
https://www.amazon.com/dp/B0B58SC95H

You can, however, use most commercially available solder pastes sold in syringes. Just keep the following in mind:

  • Viscosity: 110 Pa·s (±5). If it’s higher, extruding the paste through dispensing tips becomes extremely difficult.

  • Recommended metal particle size: 25–45 microns (Type 3).

  • Check expiration dates (when available): after 6–10 months, solder paste gradually becomes thicker and less usable. 

***

Sn42/Bi57/Ag1 high quality, low temperature, NO-Clean, Lead-Free (RoHs) solder paste filled into 10CC EFD syringes (with mounting hole inside the piston) and ready for the use with I-Extruder dispenser.

This solder paste contains 1% of silver which makes solder joints much stronger.

Quantity: 30gr (in Nordson type 10CC EFD syringe)
Chemical composition: Sn42/Bi57/Ag1
Metal Particle Size: 25-45 Microns (Type 3)
Melting Point: 137C (278F)
Flux type: NO-Clean
Viscosity: 110 Pa·s (+-5)

The low viscosity (~110 Pa·s) of that solder paste is perfect for flawless application of even with the small diameter needles, on small footprints such as: 0603, 0402, QFN...

The No-Clean flux residue is non-corrosive, non-conductive and can remain on your PCB. Alternatively, it can be removed with a suitable solvent such as isopropyl alcohol or acetone.

In addition, what is important, thanks to the low melting temperature, it allows you to protect sensitive components such as: plastic connectors, buttons, LEDs, against overheating.

Product Details
SLDP-AG1
381010
381010
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